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RFID Technology:
13.56 MHz, ISO 15693, ISO 14443

Chip Types:

• my-D (ISO 1593),
• iID-K (ISO 14443)

Communication Distance:
0 ... 50 mm

Memory:
2 kbit, 64 kbit EEPROM

Storage Temperature:
-45°C ... +125°C, short time +150°C

Packaging:

• multi layer plastic package
• carrier glass fibre reinforced
• front side black EP
• with robust stainless steel socket

Size:
approx. 33 x 30 mm, TH max. 3.0 mm

Special Features:

• for industrial applications
• equipment and item tagging
• fastening by screw or blind rivet
• maintenance solutions
• with optional printing

Datenblatt herunterladen

RFID Technology:
13.56 MHz, ISO 15693, ISO 14443

Chip Types:

• my-D (ISO 1593),
• iID-K (ISO 14443)

Communication Distance:
0 ... 50 mm

Memory:
2 kbit, 64 kbit EEPROM

Storage Temperature:
-45°C ... +125°C, short time +150°C

Packaging:

• multi layer plastic package
• carrier glass fibre reinforced
• front side black EP
• with robust stainless steel socket

Size:
approx. 33 x 30 mm, TH max. 3.0 mm

Special Features:

• for industrial applications
• equipment and item tagging
• fastening by screw or blind rivet
• maintenance solutions
• certified for ATEX II 2G Ex ib IIC T6

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RFID Technology:
far field UHF

Chip Types:
NXP G2XM

Communication Distance:

• 0 … 1.5 m (tested on polycarbonate)
• dependent on reader system
• and environmental conditions

Memory:
EEPROM

Storage Temperature:
-45°C … +180°C, max. 180°C for short term

Size:
43 x 27 mm

Special Features:

• passive RFID communication ISM UHF band, EPC Class1 Gen2 EEPROM memory
• EEPROM memory
• TAG for plastic devices and metal objects
• using under high temperature and harsh environmental conditions
• especially designed for asset management of non-metal and metal objects

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RFID Technology:
860-928 MHz, ISO 18000-6c, EPC Class 1 Gen2

Chip Types:
various chip types available, ask microsensys

Communication Distance:
0 ... 400 cm

Memory:
e.g. 512 bit user memory EEPROM

Storage Temperature:
-45°C ... +85°C

Packaging:

• EPOXY case or PE foil
• on fibre-glass reinforced substrate

Size:
approx. 70 x 18 x 3.5 mm³

Special Features:

• non-metallic and metallic mounting possible
• designed for asset management
• mounting: self-adhesive or two drills
• with PE labeling or laser printing

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RFID Technology:
13.56 MHz, ISO 15693

Chip Types:
iID-Q and my-D (ISO 15693)

Communication Distance:
0 ... 15 mm

Memory:
2k EEPROM

Storage Temperature:
+45°C ... +125°C

Packaging:

• chip in multi ferrite layer epoxy packaging,
• front side black EP

Size:
approx. 60 x 20 mm, TH 2.5 mm

Special Features:

• on metal type
• part and equipment tagging
• up to 60 year data retention available
• especially designed for building industry

Datenblatt herunterladen

RFID Technology:
13.56 MHz, ISO 15693

Chip Types:
my-D (ISO 15693)

Communication Distance:
0 ... 15 mm

Memory:
2k EEPROM

Storage Temperature:
+45°C ... +125°C

Packaging:

• chip in multi ferrite layer epoxy packaging,
• front side black EP

Size:
approx. 30 x 7.5 mm, TH 2.5 mm

Special Features:

• on metal type in slim package
• part and equipment tagging
• up to 60 year data retention available
• especially designed for building industry