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RFID Technology:
13.56 MHz, ISO 15693, ISO 14443

Chip Types:
iID-G and iID-H (ISO 15693), iID-K (ISO 14443)

Communication Distance:
0 ... 4 mm

Memory:
16 kbit or 32 kbit or 64kbit EEPROM

Storage Temperature:
-45°C ... +150°C, short time +180°C

Packaging:
half lens case, plastic packed, ferrite substrate, black EP

Size:
D 5.0 mm, TH 2.0 mm

Special Features:

• mic3^® technoogy
• mounting on metal surface
• useable on wide temperature range
• for harsh environmental conditions
• security features available

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RFID Technology:
13.56 MHz, ISO 15693, ISO 14443

Chip Types:
iID-M (ISO 15693), iID-K (ISO 14443)

Communication Distance:
0 ... 10 mm

Memory:
2 kbit or 64kbit EEPROM

Storage Temperature:
-45°C ... +125°C, short time +150°C

Packaging:

• half lens case, multi layer plastic packed
• front side black EP

Size:
D 6.7 mm, TH 2.5 mm

Special Features:

• small half lens form
• mounting on metal surface
• for harsh environmental conditions
• especially designed for tool tagging
• useful for asset management
• security features available

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RFID Technology:
13.56 MHz, ISO 15693, ISO 14443

Chip Types:
iID-M, iID-G and iID-H (ISO 15693),
iID-K (ISO 14443)

Communication Distance:
0 ... 20 mm

Memory:
2 kbit or 16 kbit or 32 kbit or 64kbit EEPROM

Storage Temperature:
-45°C ... +100°C

Packaging:

• plastic packed, black EP
• type B: half lentil case, one side EP
• type C: lentil case, both sides EP

Size:

• type B: D 7.0 mm, TH 1.9 mm
• type C: D 7.0 mm, TH 2.5 mm

Special Features:

• very useful for product identification
• applications in industry and administration
• security features available

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RFID Technology:
13.56 MHz, ISO 15693, ISO 14443

Chip Types:
SLI-X, iID-X, iID-G, iID-K
others on request

Communication Distance:
0 ... 30 mm

Memory:
1 kbit or 2 kbit or 16 kbit or 64 kbit

Storage Temperature:
-45°C ... +125°C, short time +175°C

Packaging:

• plastic packed, black EP
• type B: half lentil case, one side EP
• type C: lentil case, both sides EP

Size:

• type B: D 14.0 mm, TH 2.5 mm
• type C: D 14.0 mm, TH 3.0 mm

Special Features:

• very useful for product identification
• applications in industry and administration
• for mounting on nonmetal objects
• security features available

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RFID Technology:
13.56 MHz, ISO 15693

Chip Types:
my-D, SLI-X

Communication Distance:
0 ... 15 mm

Memory:
2 kbit or 1.6 kbit EEPROM

Storage Temperature:
-45°C ... +100°C, short time +125°C

Packaging:

• front side: EPOXY
• back side: mixed ferrite epoxy

Size:
D 15.0 mm, TH 2.5 mm

Special Features:

• for mounting in metal surface
• mid size on metal transponder
• for harsh environment conditions
• useable on metal
• 50 years data retention version
• security features available

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RFID Technology:
13.56 MHz, ISO 15693, ISO 14443

Chip Types:
iID-M and iID-G (ISO 15693), iID-K (ISO 14443), SLI-X

Communication Distance:
0 ... 20 mm

Memory:
2 kbit or 16 kbit or 64kbit or 1.6kbit EEPROM

Storage Temperature:
-45°C ... +125°C, short time +180°C

Packaging:

• half lens case, multi layer plastic package,
• front side black EP, laser printed

Size:
D 15.0 mm, TH 2.5 mm

Special Features:

• certified for ATEX zone 1 and zone 2
• mid size on metal transponder
• for harsh environment conditions
• useable on metal

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RFID Technology:
ISO 18000-6c, EPC Class1 Gen2

Chip Types:
IMPINJ M4, others on request

Communication Distance:
0 ... 50 cm

Memory:
standard, up to 512 bit user memory

Storage Temperature:
-45°C ... +130°C, short time +150°C,
up to 200°C on inquiry

Packaging:
PEEK or PA66 case, silicon molding

Size:
D 22 mm, TH 4 mm (inside of material)

Special Features:

• TAG for clicking assembly
• for harsh environment conditions
• useable on metal and non-metal